Exploring the Growing Opportunities in the 3D Semiconductor Packaging Market


The global 3D semiconductor packaging market is expected to propel at a prolific CAGR of 15% from 2022 to 2032. At present, the market is valued at US$ 8 billion and is forecasted to reach US$ 32.5 billion by the end of 2032.

The advantages of 3D semiconductor packaging over traditional packaging technologies include decreased power loss, increased efficiency, greater overall performance, and optimal space utilization. The microelectronic module aids in the miniaturization of mobile electronic devices, including sensors, smartphones, and bio-medical devices. The advent of multi-chip IC (integrated circuit) packaging is one of the major market trends.

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Thin semiconductor chips are stacked and integrated into micro-electronic modules using 3D semiconductor packaging using through silicon via technology. Additionally, it aids in reducing the size of the interposer between the package and circuit, which lowers the system’s cost and power usage.

The semiconductor industry is looking for alternatives to develop and produce innovative SoCs (system-on-chips) using SiP (system-in-package) and chiplet-based techniques by utilizing various cutting-edge packaging technologies. For high-end performance packaging, 3D integration of semiconductor components is becoming more popular.

Overall demand for ICs has increased due to the widespread usage of smartphones, which is anticipated to encourage the development of 3D packaging as ICs require strong packaging to enable small footprints and higher performance.

With sharper, lighter, and more energy-efficient features, consumer electronic products are always evolving. It raises consumer expectations for the next iteration. It is a key selling factor for companies that produce consumer devices. The demand for chips without flaws, large capital investments by various semiconductor manufacturing companies, and an increase in consumer electronics penetration are some of the reasons propelling the 3D semiconductor packaging industry

Key Companies Profiled

  • ASE Group
  • Amkor Technology Inc.
  • Intel Corporation
  • Micron Technology
  • Qualcomm Technologies, Inc.
  • 3M Company
  • Advanced Micro Devices, Inc.
  • Samsung Electronics Co. Ltd.
  • STMicroelectronics
  • Suss Microtec AG
  • Tokyo Electron Ltd.
  • Toshiba Corp.
  • United Microelectronics
  • Xilinx, Inc.

Key Takeaways from Market Study

  • The global 3D semiconductor packaging market is predicted to reach US$ 32.5 billion by 2032.
  • Market in Canada is forecasted to expand at a CAGR of 11% over the forecast period (2022-2032).
  • Demand for the package-on-package method is estimated to rise rapidly at a CAGR of 14% from 2022 to 2032.
  • Market in Japan is anticipated to progress at a CAGR of 10.5% through 2032.

“It is expected that the advent of novel packaging materials such as printed wiring boards will benefit 3D semiconductor packaging technologies. Rapid adoption of IoT and wireless technology is paving the way for 3D semiconductor packaging product manufacturers,” says a Fact.MR analyst

Winning Strategy

Top players in the 3D semiconductor packaging market are developing techniques to reduce the overall cost of advanced packaging and provide the maximum level of operational effectiveness. Leading companies’ ongoing investments in R&D initiatives are anticipated to encourage the adoption of 3D packaged chips to advance the packaging method.

For instance,

  • In 2021, Amkor Technology, Inc. announced plans to build a cutting-edge smart factory in Bac Ninh, Vietnam. The first phase of the new plant will focus on providing Advanced SiP assembly and test solutions to the leading semiconductor and electronic manufacturing companies worldwide.

“Increasing Need for 3D Stacking to Decrease Connector Length Driving Demand for Through Silicon via

Based on packaging method, 3D semiconductor packaging is divided into through silicon via (TSV), package-on-package, through glass via (TGV), and others.

Through silicon via (TSV) accounts for 40% share of the global market. A new packaging technique called 3D through silicon via (TSV) combines silicon wafers in three dimensions. The 3D TSV provides semiconductor device packaging options that are high-performing and reasonably priced.

3D Semiconductor Packaging Market 3D Semiconductor Packaging Market Share 3D Semiconductor Packaging Market Size

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